EFFECT OF ZINC CONTENT AND TEMPERATURE ON COPPER SOLDERABILITY WITH Sn-xZn (x = 4.5; 90; 95 wt.%) ALLOYS

The aim of this study was to determine the effect of temperature and Zn content on the solderability of Cu substrates with liquid Sn-xZn alloys (4.5; 90; 95 wt.% Zn). Solderability tests were carried out by the wetting balance test which allows th...

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EFFECT OF SURFACE COATING AND FLUX TYPE ON THE SOLDERABILITY OF PCB BY LEAD-FREE SAC305 ALLOY

This paper presents the results of tests on the effect of the surface coating and flux type on the solderability of PCB by lead-free tin-based SAC305 (SnAg3.0Cu0.5) alloy determining the size of the contact angle by a wetting balance method. The s...

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EFFECT OF ZINC CONTENT AND TEMPERATURE ON NICKEL SOLDERABILITY WITH Sn-xZn (x = 4.5, 90, 95 wt%) ALLOYS

The aim of this study was to determine the effect of temperature and zinc content on the solderability of nickel substrates with liquid Sn-xZn alloys (4.5, 90, 95 wt% Zn). Solderability tests were carried out by the wetting balance method which al...

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Wetting transparency of graphene deposited on copper in contact with liquid tin

Wetting behavior of liquid Sn (99.99%) on graphenecoated Cu substrate was investigated by the sessile drop method using two testing procedures: 1) classical contact heating (CH) of a couple of materials; 2) capillary purification (CP) allowing non...

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Effect of phosphorus content on the wettability of Ni-P coated surfaces by SAC305 alloy

The aim of this study was to determine the effect of the chemical composition of Ni-P coating on the wettability kinetics of SAC305 liquid solder in contact with the Ni-P coating. The study was conducted in vacuum, at 230°C, for 5 minutes, usi...

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The influence of the drop-size effect on the wetting kinetics in SAC305/Ni system

The studies of the drop-size effect on the wetting kinetics of the nickel substrate by lead-free solder were performed by the sessile drop method in a vacuum at a temperature of 260°C.In this work, Sn-based alloy SAC305 (Ag - 3.0 wt. %, ...

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Assessment of quartz wettability by the ecological foundry binder modified with nanoparticles of metal oxides

The results of studies of quartz wettability by an ecological foundry binder are presented. Water glass modified with nanoparticles of metal oxides, such as: MgO, Al2O3 and ZnO in organic solvents (methanol or propanol) was u...

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Effect of oxidation and mechanical damage of PCBs with OSP finish on their solderability with SAC305 alloy

The paper focuses on the experimental investigation of wetting behavior and solderability of commercial lead-free solder on Printed Circuit Board (PCB) covered with an OSP finish (Organic Surface Protectant) characterized by physical (mechanically...

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Wettability, reactivity and interfaces in the Gd/TiO2 system

High-temperature interaction of liquid Gd in contact with dense, polycrystalline TiO2 substrate, was investigated. Wettability and reactivity tests were carried out at two different temperatures (1362°C and 1412°C) in flowing ga...

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Wetting behavior of Si-13.5B alloy on polycrystalline h-BN-based substrates

In this work, for the first time the results of an experimental evaluation of the high temperature behavior of molten Si-B alloy in contact with refractory materials at temperatures up to 1750°C, under static argon atmosphere (p = 850-900 mbar...

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High temperature wettability and reactivity between molten Mg in contact with Ni substrate

The paper focuses on the experimental investigation of high temperature wetting behaviour of liquid pure Mg during a contact heating on Ni substrate by the sessile drop method. High temperature wettability test was performed by the ...

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