EFFECT OF SURFACE COATING AND FLUX TYPE ON THE SOLDERABILITY OF PCB BY LEAD-FREE SAC305 ALLOY

This paper presents the results of tests on the effect of the surface coating and flux type on the solderability of PCB by lead-free tin-based SAC305 (SnAg3.0Cu0.5) alloy determining the size of the contact angle by a wetting balance method. The s...

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Effect of phosphorus content on the wettability of Ni-P coated surfaces by SAC305 alloy

The aim of this study was to determine the effect of the chemical composition of Ni-P coating on the wettability kinetics of SAC305 liquid solder in contact with the Ni-P coating. The study was conducted in vacuum, at 230°C, for 5 minutes, usi...

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The influence of the drop-size effect on the wetting kinetics in SAC305/Ni system

The studies of the drop-size effect on the wetting kinetics of the nickel substrate by lead-free solder were performed by the sessile drop method in a vacuum at a temperature of 260°C.In this work, Sn-based alloy SAC305 (Ag - 3.0 wt. %, ...

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Effect of oxidation and mechanical damage of PCBs with OSP finish on their solderability with SAC305 alloy

The paper focuses on the experimental investigation of wetting behavior and solderability of commercial lead-free solder on Printed Circuit Board (PCB) covered with an OSP finish (Organic Surface Protectant) characterized by physical (mechanically...

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