EFFECT OF ZINC CONTENT AND TEMPERATURE ON COPPER SOLDERABILITY WITH Sn-xZn (x = 4.5; 90; 95 wt.%) ALLOYS

The aim of this study was to determine the effect of temperature and Zn content on the solderability of Cu substrates with liquid Sn-xZn alloys (4.5; 90; 95 wt.% Zn). Solderability tests were carried out by the wetting balance test which allows th...

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EFFECT OF SURFACE COATING AND FLUX TYPE ON THE SOLDERABILITY OF PCB BY LEAD-FREE SAC305 ALLOY

This paper presents the results of tests on the effect of the surface coating and flux type on the solderability of PCB by lead-free tin-based SAC305 (SnAg3.0Cu0.5) alloy determining the size of the contact angle by a wetting balance method. The s...

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EFFECT OF ZINC CONTENT AND TEMPERATURE ON NICKEL SOLDERABILITY WITH Sn-xZn (x = 4.5, 90, 95 wt%) ALLOYS

The aim of this study was to determine the effect of temperature and zinc content on the solderability of nickel substrates with liquid Sn-xZn alloys (4.5, 90, 95 wt% Zn). Solderability tests were carried out by the wetting balance method which al...

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Effect of oxidation and mechanical damage of PCBs with OSP finish on their solderability with SAC305 alloy

The paper focuses on the experimental investigation of wetting behavior and solderability of commercial lead-free solder on Printed Circuit Board (PCB) covered with an OSP finish (Organic Surface Protectant) characterized by physical (mechanically...

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Perspectives and directions of the development of new generation lead-free soldering alloys and their application possibilities in the consumer electronics lead-free soldering technology

The new technological challenges and the high economical and commercial potential connected with the development of new generation soldering alloys used in the consumer electronics lead-free soldering technology is a subject which is gaining incre...

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