Your search for wetting resulted in 14 matches...
The wetting behavior of Ni on a HfB2/Ta assembly was examined in vacuum using dense HfB2 (99.5% purity) produced, without sintering aids, by HP-HT at 7 GPa. The real-time imaging by a high res...
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The wettability tests were carried out under a vacuum at 700°C in the drop/substrate couples, where drop is pure aluminium (99.999%), substrate - Ni (99.8%) and Niox (oxidized). Test were carried out...
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The aim of this study was to determine the effect of temperature and Zn content on the solderability of Cu substrates with liquid Sn-xZn alloys (4.5; 90; 95 wt.% Zn). Solderability tests were carried out by the wetting balance test which allows th...
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This paper presents the results of tests on the effect of the surface coating and flux type on the solderability of PCB by lead-free tin-based SAC305 (SnAg3.0Cu0.5) alloy determining the size of the contact angle by a wetting balance method. The s...
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The aim of this study was to determine the effect of temperature and zinc content on the solderability of nickel substrates with liquid Sn-xZn alloys (4.5, 90, 95 wt% Zn). Solderability tests were carried out by the wetting balance method which al...
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The aim of this study was to determine the impact of technological factors (surface treatment and contact time) on the kinetics of wetting of nickel substrates by a liquid aluminum alloy. Wetting kinetics studies were carried out in vacuum at 700&...
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Wetting behavior of liquid Sn (99.99%) on graphenecoated Cu substrate was investigated by the sessile drop method using two testing procedures: 1) classical contact heating (CH) of a couple of materials; 2) capillary purification (CP) allowing non...
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The aim of this study was to determine the effect of the chemical composition of Ni-P coating on the wettability kinetics of SAC305 liquid solder in contact with the Ni-P coating. The study was conducted in vacuum, at 230°C, for 5 minutes, usi...
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The studies of the drop-size effect on the wetting kinetics of the nickel substrate by lead-free solder were performed by the sessile drop method in a vacuum at a temperature of 260°C.In this work, Sn-based alloy SAC305 (Ag - 3.0 wt. %, ...
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The paper focuses on the experimental investigation of wetting behavior and solderability of commercial lead-free solder on Printed Circuit Board (PCB) covered with an OSP finish (Organic Surface Protectant) characterized by physical (mechanically...
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An attempt has been made to determine the effect of the addition of an agent wetting the surface of silica sand grains, introduced in order to increase the hardening efficiency of selected physical methods applied to the ecological foundry sands b...
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In this work, for the first time the results of an experimental evaluation of the high temperature behavior of molten Si-B alloy in contact with refractory materials at temperatures up to 1750°C, under static argon atmosphere (p = 850-900 mbar...
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The wetting behavior and reactivity between molten cast iron (originally vermicular graphite cast iron, containing in wt. %: 3.70 C, 2.30 Si, 0.44 Mn, 0.054 P, 0.017 Mg, 0.015 S) and commercial polycrystalline alumina (Al2O3 ...
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The paper focuses on the experimental investigation of high temperature wetting behaviour of liquid pure Mg during a contact heating on Ni substrate by the sessile drop method. High temperature wettability test was performed by the ...
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